Lars Titerle - Info zur Person mit Bilder, News & Links

	Berlin

	Elke Zakel Laser Patent Thomas Oppert Blankenhorn Ronald Inventors Technologies

News

Netzwerk-Profile

Interessen

Lars Titerle - Patents

www.freshpatents.com

Archived* (*May have duplicates - we are upgrading our archive.) Method and device for applying a solder to a substrate ### The bibliographic ...

Business-Profile

patentbuddy: Lars Titerle

PAC TECH - PACKAGING TECHNOLOGIES GMBH, Berlin, DE

Bücher

Microjoining and Nanojoining - Seite Google Books-Ergebnisseitegoogle.com

books.google.com

Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de.

Microjoining and Nanojoining - Google Books

books.google.nl

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has...

Dokumente zum Namen

倒装芯片凸点制作方法iczhiku.com

picture.iczhiku.com

von 李福泉 · · Zitiert von: 9 — [9] Elke Zakel ,Lars Titerle ,Thomas Oppert et al. Laser solder ball application for optoelectronics and MEMS packaging. [ C] . OPTATEC , › resource › upload

Wissenschaftliche Veröffentlichungen

US Patent for Device for positioning a tool in relation to a...

patents.justia.com

Date of Patent: Oct 18, Patent Publication Number: Assignee: Pac Tec-Packaging Technologies GmbH (Nauen (bei Berlin)) Inventors: Elke Zakel (Falkenssee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Colleen P. Cooke Attorney: Dougherty, Clements & Hofer

US Patent for Method and device for applying material to a ...

patents.justia.com

Inventors: Elke Zakel (Falkensee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Brian K. Talbot › patent

US Patent Application for Method and device for applying pieces of...

patents.justia.com

Filed: Jun 19, Publication Date: Jan 22, Patent Grant number: Inventors: Oliver Uebel (Berlin), Lars Titerle (Berlin)

US Patent Application for Method and device for applying a solder to...

patents.justia.com

Filed: Aug 20, Publication Date: Apr 15, Inventors: Ghassem Azdasht (Berlin), Lars Titerle (Berlin) Application Number:

Verwandte Suchanfragen zu Lars Titerle

Paul Kasulke
Oliver Uebel
Thomas Oppert

Personen
Vorname "Lars" (24476)
Name "Titerle" (1)

sortiert nach Relevanz / Datum

Erweiterte Suche

Dossier exportieren

Person-Suchen: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Lars Titerle Person-Info

News

Netzwerk-Profile

Lars TiterleSemantic Scholar

Interessen

Lars Titerle - Patents

Business-Profile

patentbuddy: Lars Titerle

Bücher

Microjoining and Nanojoining - Seite Google Books-Ergebnisseitegoogle.com

Microjoining and Nanojoining - Google Books

Dokumente zum Namen

倒装芯片凸点制作方法iczhiku.com

Wissenschaftliche Veröffentlichungen

US Patent for Device for positioning a tool in relation to a...

US Patent for Method and device for applying material to a ...

US Patent Application for Method and device for applying pieces of...

US Patent Application for Method and device for applying a solder to...

Sonstiges

Laser Assisted Soldering and Flip-Chip Attach for MEMS ...DocPlayer.net

Includes AIMS Harsh Environment Electronics Workshop - PDF Free...

Microjoining and Nanojoining - PDF Free DownloadEPDF.MX